8GB OCZ Platinum DDR2 PC2-6400 Quad kit

Memory upgrade kit from OCZ. This is a quad channel memory upgrade, which means it consists of 4 matched memory modules. Each module rated to run at 800MHz PC2-6400 speeds. Ideal for gaming and overclocking systems that require some of the best memory available today.

The PC2-6400 8GB Quad Kit is ideal for enthusiasts, professionals, and DIY system-builders using Windows® Vista? as their choice operating system that require the performance of high-speed memory. The ultimate upgrade for hardcore gamers, the latest PC titles require large capacity memory to deliver the most powerful, stable system performance and maximize gameplay. The PC2-6400 8GB Platinum Edition is the ultimate memory solution for the latest visually-intensive PC titles, and provides unsurpassed reliability and performance to unleash every graphic possibility.

The 800MHz Platinum Edition runs at exceptional 5-4-4 timings, offering tighter latencies than typical 2GB modules, and provides unprecedented bandwidth on the latest platforms. As part of OCZ?s Platinum series, the PC2-6400 8GB Quad Kits are engineered to satisfy the demands of overclockers and enthusiasts with an optimal balance of performance, overclocking strength, and capacity.

The 8GB PC2-6400 Quad Kits are 100% hand-tested for quality assurance and compatibility and feature high quality, platinum-mirrored XTC (Xtreme Thermal Convection) heatspreaders for the most effective heat dissipation. Furthermore, each OCZ memory module is backed by the industry leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind.

With its ultra-fast performance, high quality and reliability, the OCZ PC2-6400 Platinum 8GB Quad Kit is a perfect memory upgrade for today?s memory-hungry Intel platforms.


* XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.