OCZ Ultra 5+ was designed to provide maximum thermal transer for your most demanding applications. Ultra 5+ contains 99.9% pure silver for optimal thermal transer and will not dry out, flake or lose thermal transfer ability over time. If you are looking for the absolute best in thermal compound look no further than OCZ Ultra 5+
Contains 99.9% pure silver:
OCZ Ultra 5+ uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.
High-Density:
OCZ Ultra 5+ contains over 88% thermally Conductive filler by weight. In addition to micronized silver, Ultra 5+ also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles. These thermally-enhanced ceramic particles improve the compound's performance and long-term stability.
Not Electrically Conductive:
OCZ Ultra 5+ was formulated to conduct heat, not electricity.
Absolute Stability:
OCZ Ultra 5+ will not separate, run, migrate, or bleed.
Please make sure to visit
OCZs website for information on how to apply Ultra 5+ Thermal Compound
Linking to MemoryC
