- EK Water Blocks 3831109891179, Thermal pad, Silver, 1 pc(s)
Expected to ship within 12 days of order
- Thermal pad
- Material: Aluminium, Nickel, Perspex
- Silver
Expected to ship within 12 days of order
- 10.2 W/m·K
- 3.2 g/cm³
- 1 pc(s)
Expected to ship within 12 days of order
- Prolimatech PK-2, 10.2 W/m·K, 30 g
Expected to ship within 12 days of order
- Thermal Grizzly Hydronaut, 11.8 W/m·K, 2.6 g/cm³, -200 - 350 °C, 10 ml, 26 g
Expected to ship within 12 days of order
- Maximum thermal conductivity
- Constantly high performance
- Reusable
Expected to ship within 12 days of order
- 12.5 W/m·K
- 3.7 g/cm³
- Constitutive ingredients: Silicone
Expected to ship within 12 days of order
- designed for Overclocking
- excellent thermal conductivity
- no curing
Expected to ship within 12 days of order
- Thermal Grizzly Hydronaut, Thermal paste, 11.8 W/m·K, 2.6 g/cm³, -200 - 350 °C, 3 ml, 7.8 g
Expected to ship within 12 days of order
- Prolimatech PK-3 5g, 11.2 W/m·K, 5 g
Expected to ship within 12 days of order
- Alphacool 13036, Thermal grease, Grey, 120 °C, -40 °C, 17 W/m·K, 200 Pa⋅s
Expected to ship within 12 days of order
- Thermal pad
- Supported processor sockets: LGA 1151 (Socket H4)
- Carbon
Expected to ship within 12 days of order
Thermal paste, also referred to as thermal compound, is designed to help transfer heat away from a heat source - such as a CPU or graphics card processor, to a heatsink and ultimately away from any heat sensitive component in a computer system. The PC thermal compound pastes we carry in stock are all manufactured using top quality ingredients, known to conduct heat very effectively. Some heat transfer pastes include silver, some include aluminum or other metal particles, to effectively conduct the heat. Typically available in easy-to-apply syringes, or other convenient packaging, these thermal compounds are available for every budget and every purpose.