PTI-G3606 is Silicon-base thermal grease with excellent heat-conductive filler and effective thermal grease for any heat sink device where efficient cooling is required, such as CPU power transistor, and SCRs to heat sink or chassis. It will not dry out, harden, or melt even after long term exposure to temperatures up to 240℃.
Product overview:
- Silicon-base thermal grease, PTI-G3606 is optimized to provide heat transferring efficiently and reliably from CPU to heat-sink, and not to cause electrically conductive problems while contacting the pins of an IC.
- Outperform to standard thermal compounds 4 to 10 degrees lower CPU full load core temperature.
- In syringe and brush attached enables easy application and prevents unnecessary waste.
Features:
- Extended Temperature limits: Peak: -20℃ to 180℃
- The high-density, specifically designed for modern high-power CPUs and high-performance heat-sinks or water-cooling solutions.
- Silicon-based thermal grease has moderate thermal conductivity.
- Not electrically conductive, can't cause problems if it contacts the pins of an IC.
- High thermal conductivity > 5 W/m-K.
- At a layer 0.03" thick, one tube will cover approximately 300 square inches.