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Antec Formula 7 Nano Diamond Thermal Compound - 4 Grams by Antec


Antec Formula 7 Nano Diamond Thermal Compound - 4 Grams Image
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Key Features

  • 4 g weight of FORMULA 7 Nano Diamond Thermal Compound
  • Delivers optimal heat transfer for larger-scale cooling systems, including water cooled systems
  • Lighter, easier to spread stable composition won't crack or dry out.
  • Designed with extremely demanding applications
  • Popular choice for overclockers and extreme gamers
  • Thermal conductivity 8.3 w/mk
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Details

Antec’s Formula 7 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU’s surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 7’s nano diamond particles minimize the distance between heat-conductive compounds and gladly take on an overclocking environment, optimally performing between -50°C and 250°C.

To keep your system cool and your CPU functioning comfortably, pick up Antec’s Formula 7 for a diamond-caliber solution

Specifications
WEIGHT / VOLUME 4 g
THERMAL CONDUCTIVITY 8.3 W/m·K
OPERATING TEMPERATURE -50 - 250 °C
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