Anyone who was building their gaming PC in the early 2000s can probably still recall the numerous instances of broken CPUs, as occurred with the AMD Athlon XP whose silicon core broke at the corners when mounting a CPU cooler. In order to avoid the high RMA rate of otherwise perfectly functioning processors, especially when placed in the hands of less experienced users, proceeding generations of processors - beginning with the AMD Athlon 64 and Intel Pentium III - simplified the process of mounting the CPU cooler by installing a metal heat spreader on the CPU package, thereby successfully protecting the CPU die from damage.
This mostly nickel-plated copper Integrated Heat Spreader (IHS) guides the heat produced by the chip into the CPU cooler and distributes the thermal energy over a larger surface area more effectively than raw silicon alone. In order to effectively integrate both components a Thermal Interface Material (TIM) is located between the heat spreader and the silicon chip, which itself has not consisted of solder since 2012. Instead of solder a standard thermal paste is used, and this has also gone on to take the place of solder in all proceeding series of CPU. However due to its relatively low thermal conductivity it has drastically reduced the potential for extreme overclocking.
The proportions of the CPU cooler in this instance are almost irrelevant, since the heat build-up occurs inside of the processor package. To enable effective cooling of this kind of CPU even while functioning under extreme overclocks, daring enthusiasts and extreme overclockers separate the heat spreader with a sharp razor blade or similar tools. This demands the greatest of care and a supreme confidence in your ability to avoid damaging vital components. This radical method holds a not inconsiderable degree of risk for even professional overclockers with a superabundance of experience to call upon.
OVERCLOCK TO THE LIMIT SAFELY & EASILY LIKE AN OVERCLOCKING CHAMPION!
The grandmaster of benchmarking Roman "der8auer" Hartung developed the Delid Die Mate X with the aim of enabling everyone to easily and safely remove the heatspreader themselves, without having to take into account a shortened CPU lifespan. The name of this CPU delidding tool, manufactured in black anodised aluminium with durable stainless steel components, is synonymous all over the world with CPU delidding. This device allows the heatspreader to be safely removed in under a minute, while the processor requiring delidding is simply inserted into the receiving module of the Delid Die Mate X in accordance with the CPU's arrow marking. Subsequently the slider responsible for delidding the CPU is inserted and then slowly and evenly tightened by means of an Allen key to completely remove the heat spreader, which is then separated from the processor. This method allows the removal process to be performed absolutely reliably and without risk of damage.
This previously dangerous act of DIY is turned into something routine and harmless, thereby guaranteeing that the CPU and the now accessible CPU components survive unscathed. This opens up completely new possibilities in the realm of CPU modding to extreme overclockers and their aspirational counterparts everywhere. The issue of additional heat transfer between heat spreader and silicon has now disappeared and the CPU's temperature falls precipitously as a consequence - even without any overclocking. An additional advantage is that a more premium thermal paste with improved conductivity can and should be chosen, for example the offering from Thermal Grizzly. The results speak for themselves: Temperature reductions of 10 °C to 20 °C are achievable.
A popular alternative for some processor generations lies in the choice of Thermal Interface Material e.g. replacing it with a liquid metal thermal paste offering notably improved conductivity. This subsequently allows the heat spreader and a full cooler to be reattached as normal by means of silicon adhesive. To maintain reliable contact between the heat spreader and the CPU, the third component of the Delid Die Mate 2 is required, this is inserted over the receiving module and enacts a vice-like pressure from above. It should be ensured, however, that the amount of pressure applied is not excessive in order to prevent damage to the CPU.