32GB G.Skill DDR4 PC4-21300 2666MHz Ripjaws V CL19 Dual Channel kit (2x16GB) 1.20V
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32GB G.Skill DDR4 Trident Z Royal Silver 3200Mhz PC4-25600 CL16 1.35V Dual Channel Kit (2x16GB)
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8GB Kingston DDR4 3200MHz CL22 Memory Module
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4GB Kingston ValueRAM DDR4 2666MHz PC4-21300 CL19 Memory Module
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VENGEANCE LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the eight-layer PCB helps manage heat and provides superior overclocking headroom.
DESIGNED FOR HIGH-PERFORMANCE OVERCLOCKING
VENGEANCE LPX memory is designed for high-performance overclocking. The heatspreader is made of pure aluminum for faster heat dissipation, and the custom performance PCB helps manage heat and provides superior overclocking headroom. Each IC is individually screened for peak performance potential.
COMPATIBILITY TESTED
Part of our exhaustive testing process includes performance and compatibility testing on nearly every motherboard on the market – and a few that aren’t.
XMP 2.0 SUPPORT
One setting is all it takes to automatically adjust to the fastest safe speed for your VENGEANCE LPX kit. You’ll get amazing, reliable performance without lockups or other strange behavior.
ALUMINUM HEAT SPREADER
Overclocking overhead is limited by operating temperature. The unique design of the VENGEANCE LPX heat spreader optimally pulls heat away from the ICs and into your system’s cooling path, so you can push it harder.
DESIGNED FOR HIGH-PERFORMANCE OVERCLOCKING
Each VENGEANCE LPX module is built from an custom performance PCB and highly-screened memory ICs. The efficient heat spreader provides effective cooling to improve overclocking potential.
LOW-PROFILE DESIGN
The small form factor makes it ideal for smaller cases or any system where internal space is at a premium.
| CAPACITY | 64GB |
| MEMORY SPEED | 2400MHz |
| SINGLE/DUAL/TRIPLE | Dual channel kit |
| CAS LATENCY | CL16 |
| VOLTAGE | 1.2 V |
| NUMBER OF PINS | 288-pin DIMM |
| CONFIGURATION | 2 x 32GB |
| FEATURES | Intel Extreme Memory Profile (XMP) Cooling type: Heatsink |
| PACKAGING | Retail packaging |