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StarTech 20G CPU Thermal Paste Compound by StarTech


StarTech 20G CPU Thermal Paste Compound Image

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Key Features

  • StarTech Thermal Paste Compound
  • Improves heat transfer between CPU and heatsink to keep CPU running cooler
  • Effectively fills surface imperfections on CPU to prevent air pockets
  • Ceramic-based compound that is electrically non-conductive, for safe use
  • Works more efficiently to remove harmful heat from the CPU
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Details

The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.

This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.


Specifications
WEIGHT / VOLUME 24g
THERMAL CONDUCTIVITY 1.066 W/m·K
OPERATING TEMPERATURE -68 - 212 °F
COLOR White
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