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Thermal Grizzly Intel Mycro Direct-Die Pro Water block
FD3434739
TG-MY-DD-P-RGB-I-V1
- Direct-die cooling design — Mounts directly onto the exposed die of compatible delidded Intel LGA1700 processors for an optimized cooling path.
- Enhanced Pro microfin coldplate — Nickel-plated copper construction with additional cooling fins and optimized channels for efficient heat transfer and reduced flow resistance.
- Liquid-metal compatible surface — Nickel plating acts as a barrier to help prevent gallium-based liquid metal from diffusing into the copper coldplate.
$210 39
no Sales Tax
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Thermal Grizzly Minus Pad Extreme (Thermal Pad) 120x20x1mm
17241
TG-MPE-120-20-10-R
- Single thermal pad with dimensions of 120 x 20 x 1mm
- Silicone based with a consistency like modeling clay
- Engineered in Germany by Thermal Grizzly
$55 37
no Sales Tax
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Thermal Grizzly KryoSheet Graphene Thermal Pad - 24 x 12 mm
17236
TG-KS-24-12
- 24mm x 12mm thermal pad (thickness 0.2mm)
- Temperature range from -250 °C to +150 °C
- Excellent thermal conductivity
$21 50
no Sales Tax
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Thermal Grizzly Minus Pad 8 (Thermal Pad) 120x20x1.0mm - 2-pack
15220
TG-MP8-1202010-2R
- Thermal pad with dimensions of 120mm x 20mm
- Thickness of 1mm
- Highly elastic and flexible surface area and ultra-high thermal conductivity
$20 57
no Sales Tax
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Thermal Grizzly Minus Pad 8 (Thermal Pad) 120x20x1.0mm
15221
TG-MP8-1202010-1R
- Single thermal pad with dimensions of 120mm x 20mm
- Thickness of 1mm
- Highly elastic and flexible surface area and ultra-high thermal conductivity
$16 41
no Sales Tax
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Thermal Grizzly Hydronaut heat sink compound Thermal paste 11.8 W/m·K 1 g
FD694949
TG-H-001-RS
- Thermal Grizzly Hydronaut, Thermal paste, 11.8 W/m·K, 2.6 g/cm³, -200 - 350 °C, 1 g
$13 93
no Sales Tax
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Thermal Grizzly Minus Pad 8 heat sink compound 8 W/m·K
FD695762
TG-MP8-30-30-20-1R
- Thermal Grizzly Minus Pad 8, 8 W/m·K, Metal oxide, Silicone, -100 - 250 °C, 30 mm, 30 mm, 2 mm
$14 13
no Sales Tax
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Thermal Grizzly Minus Pad 8 Thermal pad
FD695758
TG-MP8-120-20-10-2R
- High thermal conductivity
- High compressibility
- Electrical insulation
$15 82
no Sales Tax
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Thermal Grizzly Kryonaut heat sink compound 12.5 W/m·K 11.1 g
FD695775
TG-K-030-R
- 12.5 W/m·K
- 3.7 g/cm³
- Constitutive ingredients: Silicone
$41 11
no Sales Tax
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Thermal Grizzly Kryonaut Thermal grease
FD695774
TG-K-015-R
- designed for Overclocking
- excellent thermal conductivity
- no curing
$33 53
no Sales Tax
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Thermal Grizzly Minus Pad 8 heat sink compound 8 W/m·K
FD695765
TG-MP8-30-30-05-1R
- Thermal Grizzly Minus Pad 8, 8 W/m·K, Metal oxide, Silicone, -100 - 250 °C, 30 mm, 30 mm, 0.5 mm
$11 05
no Sales Tax
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Thermal Grizzly Hydronaut heat sink compound 11.8 W/m·K 26 g
FD694877
TG-H-100-R
- Thermal Grizzly Hydronaut, 11.8 W/m·K, 2.6 g/cm³, -200 - 350 °C, 10 ml, 26 g
$50 25
no Sales Tax
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Thermal Grizzly Minus Pad 8 heat sink compound 8 W/m·K
FD695761
TG-MP8-120-20-05-1R
- Thermal Grizzly Minus Pad 8, 8 W/m·K, Metal oxide, Silicone, -100 - 250 °C, 120 mm, 20 mm, 0.5 mm
$13 30
no Sales Tax
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Thermal Grizzly Carbonaut Thermal pad
FD1789227
TG-CA-32-32-02-R
- Thermal pad
- Supported processor sockets: LGA 1151 (Socket H4)
- Carbon
$22 81
no Sales Tax
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Thermal Grizzly Conductonaut heat sink compound 73 W/m·K 5 g
FD693842
TG-C-005-R
- 73 W/m·K
- 6.24 g/cm³
- Constitutive ingredients: Metal oxide
$65 33
no Sales Tax
OUT OF STOCK
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