Antec Formula 6 Nano Diamond Thermal Paste

by Antec
Antec Formula 6 Nano Diamond Thermal Paste Image

Key Features

  • Formula 6 Thermal Paste
  • 4g easy-to-apply syringe
  • Thermal conductivity of 5.3 W/m·K
  • Antec is a premium manufacturer of cooling products
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Details

Antec’s Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU’s surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 6’s nano diamond particles minimize the distance between heat-conductive compounds and gladly take on the highest demanding CPU, optimally performing between -30°C and 250°C. To keep your system cool and your CPU functioning comfortably, pick up Antec’s Formula 6 for a diamond-caliber solution.

Specifications

WEIGHT / VOLUME 4g
THERMAL CONDUCTIVITY 5.3 W/m·K
OPERATING TEMPERATURE -30 - 250 °C
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