Antec Formula 7 Nano Diamond Thermal Compound - 4 Grams by Antec
- 1 review
- Item Number: 274-0002
- Part Number: 0-761345-77061-3
No longer available. See alternative options
Key Features
- 4 g weight of FORMULA 7 Nano Diamond Thermal Compound
- Delivers optimal heat transfer for larger-scale cooling systems, including water cooled systems
- Lighter, easier to spread stable composition won't crack or dry out.
- Designed with extremely demanding applications
- Popular choice for overclockers and extreme gamers
- Thermal conductivity 8.3 w/mk
See product description
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Details
Antec’s Formula 7 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU’s surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 7’s nano diamond particles minimize the distance between heat-conductive compounds and gladly take on an overclocking environment, optimally performing between -50°C and 250°C.
To keep your system cool and your CPU functioning comfortably, pick up Antec’s Formula 7 for a diamond-caliber solution
Specifications
| WEIGHT / VOLUME | 4 g |
| THERMAL CONDUCTIVITY | 8.3 W/m·K |
| OPERATING TEMPERATURE | -50 - 250 °C |